3D Solder Paste Inspection SPI

● 3D solder paste inspection based on white-lightsine stripe PMP technology;

● Solder paste height inspection accuracy reaches 1 um;

● Auto-restore pad 3D data on PCB surface, calculate thevolume, area, height and deviation of every solder 

● Multi-direction,multi-angle 3D PMP inspection;

● Vivid and easy to used graphic interaction interface, comprehensive function and easy to handle;

● In addition to programming with Gerber file, image-oriented edit mode can also realize off-lineprogramming and debugging;

● Multi-touch function can realize 3D image rotationand 2D image resizing, convenient to check and confirm solder paste condition;

● Comprehensives SPC function includes manykind of diagrams generation and output;

● Image accelerate calculations base on multi-GPU;

● Integrated cast iron frame structure, highrigidity can avoid outside vibration