Die Top System - Fully leverage the performance of power modules

Die Top System - Fully leverage the performance of power modules

Heraeus Electronics Die Top System (DTS) has taken the lifespan and power density of power modules to a new level, which is key to helping customers break free from the constraints of traditional chip connections. The use of DTS can greatly enhance the durability and efficiency of high-power applications.

Main features of Heraeus Electronics Die Top System

The reason why Heraeus Electronics DTS stands out among similar products is that it has made significant progress in reliability and current carrying capacity:

Performance enhancement: Compared to chip bonding and aluminum wire bonding, the current carrying capacity of the chip is increased by more than 50%, and the service life is extended by more than 50 times.
Higher junction temperature: exceeding 200 ° C, thereby reducing power derating and potentially reducing chip size.
Maximizing cost-effectiveness: significantly reducing labor costs, optimizing performance, and improving profitability.
Advanced technology and customized services

Considering customers' requirements for precision and customization, Heraeus Electronics can customize DTS according to specific needs ® Customizing the configuration brings significant technical advantages:

Selection of bonding substrates: various core materials such as bare copper and copper alloys, as well as functional surfaces such as silver, gold, or palladium. The thickness range is 30-500 µ m, the thermal conductivity is 180-390 W/mK, and the tensile strength is 200-650 N/mm2.
Pre applied sintered silver: To ensure optimal sintering effect, it is recommended to use a pressure range of 10-30MPa and a temperature range of 230-280 ° C. If the thermal conductivity exceeds 150 W/mK, no cleaning process is required.

Tailor made, pursuing excellence

Heraeus Electronics' expert team helps customers find the best configuration that suits their design. Our factory is fully equipped to test all materials in DTS and provide ideal matching solutions, greatly improving system performance and reliability.

Becoming a partner of Heraeus Electronics:
Choosing Heraeus Electronics means you have a partner who can help you accelerate and optimize your development process. Heraeus Electronics has rich application experience and strong innovation capabilities, which will definitely benefit you greatly. Please believe that, as stated in our Customer Statement, we will strictly abide by the confidentiality agreement and resolutely safeguard intellectual property rights.

Heraeus Electronics and Danfoss Corporation have entered into a strategic partnership to establish Danfoss BondBuffer ® Technology is incorporated into the specific intellectual property rights of Heraeus Electronics and Danfoss, promoting industry progress and providing you with the most advanced solutions.

Die Top System supports wide bandgap semiconductor materials and future high-temperature applications:

• Power transmission systems for hybrid electric vehicles and pure electric vehicles
• Wind power
• Traction
• Power conversion